Aluminum substrate suitable for small lot production.
A printed circuit board using a highly heat-dissipating aluminum base! We also accommodate small lot production.
"Aluminum substrate" is a printed circuit board that uses a high thermal conductivity aluminum base. The material accommodates board thicknesses from 0.6mm to 3.0mm, and it can support copper foil thicknesses from 35um to 105um. The maximum sizes are 600mm x 400mm and 1500mm x 250mm. Small lot production can reduce initial mold costs through router processing. Mass production can lower substrate costs with mold support. 【Features】 - Uses a high thermal conductivity aluminum base - Supports various types of data - Capable of panelization for mass production from individual piece data *For more details, please refer to the PDF document or feel free to contact us.
- Company：サーリューション
- Price：Other
